Flex PCBs are manufactured of polyimide and LCP. High flexibility is inherently obtained because of the thin dielectric thickness down to 12 µm. Therefore highly miniaturized 3D-designs as well as stress resistance dynamic connections are readily realized.
Flexible printed circuit boards are available in thicknesses starting from 25 µm. GS Swiss PCB AG has more than 12 years experience in the manufacturing of flex PCBs with blind and buried vias also featuring highly complex contours. We will gladly assist you with your designs.
High degree of miniaturization thanks to system in package (SiP) on flexible substrate
This 65 µm thin flex PCB (electromechanical thickness) is folded three times and sealed after being assembled with bare dies (COF) and small SMD-components. This allows the realization of a complex electronic design with digital signal processing requiring minimum space and exhibiting maximum form factor. Various electronic functions are combined in this BGA type housing to form a custom specific electronic component (SiP).
3-layer flexible substrate for hearing instrument
The flexibility of the substrate is varied by removing the outer metal layers on this substrate which is about 150 µm thick. Where all three metal layers are present, the substrate is more rigid and components are easily assembled, while the flex bending zones enable complex 3D shapes during final assembly.
Flex PCB as substitute for cables
This two layer flex circuit joins three arms with a rigidized center piece without the use of any connectors and therefore increases the reliability substantially. At the same time the assembly cost is lowered and the number of components reduced. The dimensions of this PCB are 532 x 77 mm.
